Wärmeabsorbierende Platte

Details

Veröffentlichungs-Nr.

EP4766056

Anmeldetag

20. November 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

A heat absorbing plate (A) includes: a plate surface (10a) in contact with a first bottom surface (1a) of a first electronic component (1) and a second bottom surface (2a) of a second electronic component (2) that generates a relatively smaller amount of heat than the first electronic component (1); and a flow path (P) formed inside the heat absorbing plate (A) to flow therethrough a heat absorbing liquid (F) that absorbs heat generated by the first and second electronic components (1, 2), the flow path (P) including: a first flow path portion (P1); and a second flow path portion (P2) relatively smaller in a height and a cross-sectional area than the first flow path portion (P1). The heat absorbing liquid (F) exchanges heat with the first electronic component (1) in the first flow path portion (P1) and the second electronic component (2) in the second flow path portion (P2).

Anmelder

Firma

AISIN CORPORATION

Land

🇯🇵 Japan

Fachgebiete