Kühlung für die Elektronik eines Datenzentrums

Details

Veröffentlichungs-Nr.

EP4766059

Anmeldetag

16. Dezember 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

An electronics enclosure system includes an enclosure (10), one or more electronics racks (12) positioned in the enclosure (10) and a cooling system to cool the one or more electronics racks (12). The cooling system includes a plurality of spray nozzles (22) positioned inside the enclosure (10) and configured to spray a cooling fluid onto the electronics rack (12) to cool the electronics rack (12). The plurality of spray nozzles (22) are operably connected to a vapor compression circuit (26) configured to cool the cooling fluid.A method of cooling an electronics rack (12) includes positioning one or more electronics racks (12) in an enclosure (10), operating a cooling system to spray a cooling fluid onto the electronics rack (12) from a plurality of spray nozzles (22) positioned inside the enclosure (10) to cool the electronics rack (12), and cooling the cooling fluid via a vapor compression circuit (26) operably connected to the plurality of spray nozzles (22).

Anmelder

Firma

Carrier Corporation

Land

🇺🇸 USA