Kühlanordnung für Elektronische Komponenten

Details

Veröffentlichungs-Nr.

EP4766060

Anmeldetag

19. Dezember 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

An electronic component cooling assembly includes an electronic component and a housing defining a slot such that at least a portion of the electronic component is positioned within the slot. The housing further defining an impingement cooling passage fluidly coupled to the slot. The electronic component cooling assembly includes a thermal insert positioned between the electronic component and the housing in the vertical direction, with the thermal insert defining a chamber such that the impingement cooling passage directs a fluid jet into the chamber and onto the electronic component. The thermal insert further defines a cavity spaced apart from the chamber in the longitudinal and/or the transverse direction. Additionally, the electronic component cooling assembly includes a phase change material positioned within the cavity and configured to absorb heat from the electronic component.

Anmelder

Firma

General Electric Company

Land

🇺🇸 USA