Glasdurchkontaktierungen mit Mehrschichtiger Organischer/anorganischer Auskleidung für Integrierte Schaltungsvorrichtungspackungen

Details

Veröffentlichungs-Nr.

EP4766140

Anmeldetag

17. Oktober 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

Integrated circuit (IC) die packages including a glass with conductive features embedded within the glass, such as through-glass vias (TGVs). The embedded features comprise metallization separated from the glass by an intervening multi-layered liner that includes both organic and inorganic material layers. In exemplary embodiments, the organic material has a low elastic (Young's) modulus to accommodate internal stress between the glass and the metallization. An inorganic material layer of the liner may be nitride, such as a metal nitride or silicon nitride, and in direct contact with the glass. The multi-layered liner stack may further comprise another inorganic material layer in contact with the metallization and encapsulating the organic material layer.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA