Integrierte Schaltungspackungen mit einem Organischen Substrat und einem Brückenchip mit Nicht-Lötenden Verbindungen

Details

Veröffentlichungs-Nr.

EP4766141

Anmeldetag

12. November 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die surrounded by an insulating material, the die having a first conductive contact at a first surface and a second conductive contact at a second surface opposite the first surface, a first redistribution layer (RDL), on the first surface of the die, including a first conductive pathway through a first dielectric material electrically coupled to the first conductive contact of the die by a first solderless metal-metal interconnect; and a second RDL, on second surface of the die, including a second conductive pathway through a second dielectric material electrically coupled to the second conductive contact of the die by a second solderless metal-metal interconnect, wherein a thickness of the die is between 20 microns and 45 microns. In some embodiments, a thickness of the die is between 60 microns and 75 microns.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA