Mikroelektronische Anordnungen mit Disaggregierten Komponenten

Details

Veröffentlichungs-Nr.

EP4766143

Anmeldetag

11. November 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

In one example, a microelectronic assembly with disaggregated components includes an interposer over a substrate and conductive interconnects (e.g., one or more of conductive pillars, solder caps, and solder balls) between and coupled with the substrate and the interposer. One or more dies may be coupled with a top side of the interposer. A further die may be coupled with the package side of the interposer. The further die may be, for example, in the bump field between the interposer and the substrate. In some examples, the further die may be embedded in the substrate. In some examples, the further die may be TSV-less, and lack conductive interconnects in direct contact with conductive contacts of the substrate. In some examples, the further die may be embedded within redistribution layers (RDLs) of the interposer and coplanar with conductive pillars between RDLs.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA