Modul und Vorrichtung

Details

Veröffentlichungs-Nr.

EP4766148

Anmeldetag

10. Dezember 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

A width (Dc) of an intermediate portion (33), which is defined by a first semiconductor element (10) and a second semiconductor element (20), is smaller than a sum of a thickness (Ta) of a lower portion (31) and a thickness (Tb) of a lower portion (32), and a distance (Da) from at least part of a contour (10) of a projection of the first semiconductor element (10) onto the mounting surface (2) to at least part of an outer edge (311) of a board bonding surface, which is a bonding surface (300) of the adhesive (30) bonded to the wiring board (1), is smaller than the width (Dc).

Anmelder

Firma

Canon Kabushiki Kaisha

Land

🇯🇵 Japan