Doppelpumpensystem und Verfahren zur Steuerung der Länge des Wellenlötmittelkontakts

Details

Veröffentlichungs-Nr.

EP4768161

Anmeldetag

17. November 2025

Veröffentlichung

1. Juli 2026

Rechtsraum

EP

IPC

B23K1/00, B23K1/08, B23K3/06

Abstract

A wave soldering station of a wave soldering machine includes a flow duct positioned in a reservoir of a solder pot, and a core frame supported by the flow duct. The wave soldering station further includes a first pump to deliver solder material to a first chamber, a second pump to deliver solder material to a second chamber, and a wave soldering nozzle assembly supported by the core frame. The wave soldering nozzle assembly includes a solder distribution baffle to create a solder wave, and an exit wing coupled to the core frame and configured to move from a lowered position to enable increased solder flow and a raised position to decrease flow of solder material. The first pump, the second pump and the exit wing are configured to control the flow of solder through the solder distribution baffle to vary a contact length of the solder wave.

Anmelder

Firma

Illinois Tool Works Inc.

Land

🇺🇸 USA

Fachgebiete