Abdeckplatte und Elektronische Vorrichtung
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4768456
- Anmeldetag
- 19. Juli 2024
- Veröffentlichung
- 3. Juli 2025
- Rechtsraum
- EP
Abstract
This application provides a cover plate and an electronic device, and relates to the field of electronic product technologies, to improve scratch resistance of the cover plate and ensure an appearance yield of the cover plate. This can take into account both the scratch resistance and the appearance yield of the cover plate. The cover plate includes a substrate and a scratch-resistant film layer that are disposed in a stacked manner. The scratch-resistant film layer includes a silicon element and a doped element, a valence state of the doped element is a valence of +3 or a valence of +5, and the doped element does not include a nitrogen element.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
1.740 Patente in unserer Datenbank