Lichtempfindliche Polyimidzusammensetzung, Musterherstellungsverfahren, Gehärtetes Produkt und Elektronische Komponente

Details

Veröffentlichungs-Nr.

EP4768511

Anmeldetag

7. Januar 2025

Veröffentlichung

15. Mai 2026

Rechtsraum

EP

Abstract

The present invention relates to the technical field of photosensitive dielectric materials, and specifically to a photosensitive polyimide composition, a manufacturing method for a pattern, a cured product, and an electronic component. The photosensitive polyimide composition includes a component (a) graft polymer soluble in an alkaline aqueous solution, which is selected from compounds represented by a structural formula as follows:wherein Ar₁ is selected from tetravalent organic groups, Ar₂ is selected from divalent organic groups; m + n = 5 to 200, n / (m + n) = 0.05 to 1, and k = 2 to 10; a component (b) photosensitizer; a component (c) thermal crosslinker, which contains a component (c1) crosslinker containing epoxy groups and a component (c2) a CH₂OR'-containing crosslinker; and a component (d) silane coupling agent. The photosensitive polyimide composition has excellent sensitivity and resolution, is capable of replicating fine patterns, and after curing at 200 °C, has low warpage stress and high chemical stability and adhesion.

Anmelder

Firmen

Jiangsu Aisen Semiconductor Material Co., Ltd.
Aisen Semiconductor Materials (Nantong) Co., Ltd.

Land

🇨🇳 China