Modulmontagestruktur und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4769067

Anmeldetag

20. August 2024

Veröffentlichung

1. Juli 2026

Rechtsraum

EP

IPC

G06F1/18

Abstract

Provided is a module mounting structure that has good area efficiency and does not impose stress on chips. A module mounting structure includes: a cover that covers a front surface of a memory module on which a memory chip is mounted; a relay connector board that is located between a rear side of a part of the memory module where the memory chip is mounted and a substrate, and brings a large number of contact portions of the memory module and a large number of contact portions of the substrate into contact with each other by a large number of elastic pins; and a screw that fastens the cover, a module board of the memory module, the relay connector board, and the substrate in a Z direction. The cover includes a board support protruding portion that protrudes toward the substrate and abuts on the module board along the memory chip.

Anmelder

Firma

Lenovo (Singapore) Pte. Ltd.

Land

🇸🇬 Singapur

Fachgebiete