Timing-Aus-Verfahren und -Vorrichtung, Elektronische Vorrichtung und Speichermedium

Details

Veröffentlichungs-Nr.

EP4769202

Anmeldetag

13. Juni 2025

Veröffentlichung

15. Mai 2026

Rechtsraum

EP

IPC

G06F30/3312

Abstract

Embodiments of the present disclosure disclose a timing sign-off method and apparatus, an electronic device, and a storage medium, which relate to the technical field of integrated circuits and can effectively reduce the pessimism and the complexity of timing sign-off for 3D integrated chips. The method includes: obtaining a first standard cell library corresponding to each of dies in a chip to be signed off, in which each of standard cells in the first standard cell library owns 3D process corner timing parameters, which comprise an average delay of each of the standard cells at a 3D process corner and a delay standard deviation of the standard cell at the 3D process corner, and in which the chip to be signed off is obtained by 3D integration of at least two dies; and performing timing sign-off for the chip to be signed off using the first standard cell library. The present disclosure is applicable to timing sign-off for chips.

Anmelder

Firma

Hygon Information Technology Co., Ltd.

Land

🇨🇳 China

Fachgebiete