Elektrisch Leitfähige Paste, Rfid-Inlay und Verfahren zur Herstellung eines Rfid-Inlays
Anmelder: Sekisui Chemical Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4769444
- Anmeldetag
- 22. August 2024
- Veröffentlichung
- 6. März 2025
- Rechtsraum
- EP
Abstract
Provided is a conductive paste capable of 1) enhancing storage stability, and capable of 2) enhancing curability, 3) enhancing adhesiveness, 4) improving tackiness of a cured product, and 5) enhancing conduction reliability even when mounting is performed in a relatively short time. A conductive paste according to the present invention is a conductive paste containing: a curable compound; a curing agent; and a conductive filler, an exothermic onset temperature being 50°C or higher and 80°C or lower when the conductive paste is heated from 30°C to 200°C at a temperature increasing rate of 10°C/min and subjected to differential scanning calorimetry.
Anmelder
- Firma
- Sekisui Chemical Co., Ltd.
- Land
- 🇯🇵 Japan
Japanischer Chemiekonzern mit Sitz in Osaka, tätig in den Bereichen Hochleistungskunststoffe, Bauelemente und elektronische Materialien.
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