Leitfähige Paste, Rfid-Inlay und Verfahren zur Herstellung eines Rfid-Inlays

Details

Veröffentlichungs-Nr.

EP4769445

Anmeldetag

22. August 2024

Veröffentlichung

6. März 2025

Rechtsraum

EP

Abstract

Provided is a conductive paste capable of 1) enhancing storage stability, and capable of 2) enhancing curability, 3) enhancing adhesiveness, 4) improving tackiness of a cured product, and 5) enhancing conduction reliability even when mounting is performed in a relatively short time. A conductive paste according to the present invention contains a thermosetting compound, a thermosetting agent, a conductive filler, a thixotropic agent, and an antioxidant, thermosetting agent containing a microcapsule-type thermosetting agent or a thermosetting agent that is a solid at 25°C.

Anmelder

Firma

Sekisui Chemical Co., Ltd.

Land

🇯🇵 Japan