Elektronische Vorrichtung und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP4769480

Anmeldetag

9. August 2024

Veröffentlichung

27. Februar 2025

Rechtsraum

EP

Abstract

An object of the present disclosure is to make it possible to excellently join a functional part to a substrate even when warpage of the functional part has occurred. An electronic device (10) includes a functional part (102), a substrate (130) that supports the functional part (102), a first metallic film (110) as an electrode deposited on a side of the functional part (102) facing the substrate (130), and a second metallic film (140) which is formed on the substrate (130) and to which the first metallic film (110) is joined. The functional part (102) includes a first surface (102a) that faces the substrate (130) via the first metallic film (110) and a second surface (102b) that extends from the first surface (102a) in a direction different from an extending direction of the first surface (102a). The first metallic film (110) is deposited from the first surface (102a) of the functional part (102) to a part of the second surface (102b).

Anmelder

Firma

Oki Electric Industry Co., Ltd.

Land

🇯🇵 Japan