Substratverarbeitungsvorrichtung und Förderverfahren
Anmelder: Tokyo Electron Limited 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4769486
- Anmeldetag
- 8. August 2024
- Veröffentlichung
- 27. Februar 2025
- Rechtsraum
- EP
Abstract
A substrate processing apparatus that performs processing on a substrate which is accommodated in a cassette and is to be transferred, includes: at least one transfer block configured to transfer the substrate in an interior of the at least one transfer block; a substrate processing module configured to perform the processing on the substrate; and a cassette transfer mechanism configured to transfer the cassette between a delivery position set on an outer surface of the substrate processing apparatus and a loading/unloading position at which the cassette is loaded into and unloaded from an interior of the substrate processing apparatus. The cassette transfer mechanism includes a stage on which the cassette is placed, and a moving mechanism configured to move the cassette placed on the stage.
Anmelder
- Firma
- Tokyo Electron Limited
- Land
- 🇯🇵 Japan
Japanisches Technologieunternehmen mit Sitz in Tokio, einer der weltweit größten Hersteller von Halbleiterfertigungsanlagen. Aktiv in Beschichtungs-, Ätz- und Reinigungssystemen für die Chip- und Displayproduktion.
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Vertreten von
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Hoffmann Eitle
Hoffmann Eitle · München