Endgerätevorrichtung
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4769832
- Anmeldetag
- 12. Februar 2025
- Veröffentlichung
- 11. September 2025
- Rechtsraum
- EP
- IPC
- H01Q1/36
Abstract
This application provides a terminal device, including a metal floor, a radiation stub, and a feed source. The radiation stub is disposed adjacent to and parallel to a preset side of the metal floor, where a projection on the preset side of the metal floor is located inside the preset side, and the radiation stub includes at least one connection portion connected to the preset side of the metal floor. The feed source is electrically connected to the radiation stub, and is configured to excite the radiation stub to generate an excitation current conducted in a first direction, so that the preset side of the metal floor generates a floor current, where a direction of a floor current of a first region corresponding to the radiation stub in the preset side of the metal floor is a second direction, a direction of a floor current of a second region in the preset side of the metal floor is the first direction, the second region is adjacent to the first region, the second direction is opposite to the first direction, and the radiation stub includes a main stub whose electrical length is 1/2 wavelength corresponding to a preset frequency band. Such current distribution reduces a directivity factor after superposition of far-field radiation electric field vectors, thereby improving omnidirectionality of an antenna.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
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Fachgebiete
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