Gehäuseanordnung und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4770061

Anmeldetag

2. August 2024

Veröffentlichung

26. Juni 2025

Rechtsraum

EP

IPC

H04M1/02

Abstract

This application provides a housing assembly and an electronic device. The housing assembly includes an outer decoration member, an inner decoration member, a first sealing adhesive layer, an outer housing, and a second sealing adhesive layer. The inner decoration member includes an inner sealing ring, a retaining ring, and an outer sealing ring. An annular inner wall of a through hole of the outer housing includes an embedded annular part close to a center of the through hole, and an exposed annular part away from the center of the through hole and connected to the embedded annular part. The outer sealing ring includes a first outer sealing interval ring, the first outer sealing interval ring extends to the exposed annular part of the outer housing, the second sealing adhesive layer includes a first interval adhesive layer, and the first interval adhesive layer is sealedly connected between the first outer sealing interval ring of the outer sealing ring and the exposed annular part. The first outer sealing interval ring of the inner decoration member "extends" to the exposed annular part of the outer housing, to provide extended mounting space for a large-size camera, to satisfy a requirement for mounting a large-size camera of an ultra-thin and waterproof mobile phone.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China

Fachgebiete