Mikrofonmodul und Wearable-Vorrichtung mit dem Mikrofonmodul
Anmelder: Harman International Industries, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4770117
- Anmeldetag
- 12. Dezember 2025
- Veröffentlichung
- 1. Juli 2026
- Rechtsraum
- EP
- IPC
- H04R1/08
Abstract
The present invention provides a microphone module, comprising: a housing; a microphone unit disposed in the housing and located at the bottom of the housing; a top sound hole area located at the top of the housing; a first windproof net covering the top sound hole area; a windproof cotton unit disposed between the top sound hole area 5 and the microphone unit; and a second windproof net disposed between the windproof cotton unit and the microphone unit. The present invention also provides a wearable device, including the microphone module as described above. This invention provides a microphone module with excellent windproof and noise-reducing functions, which can ensure clear call quality in windy weather with wind speeds of up to 9 m/s or even 11 m/s. In addition, the microphone module is small and modular, and can be embedded in wearable devices of any shape.
Anmelder
- Firma
- Harman International Industries, Inc.
- Land
- 🇺🇸 USA
US-amerikanisches Unternehmen für Audio- und Vernetzungstechnologien, Tochter von Samsung. Harman entwickelt Lautsprecher, Infotainmentsysteme, Konnektivitätslösungen und Audiogeräte für Automobil- und Consumer-Markt.
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Westphal, Mussgnug & Partner Patentanwälte mbB
Westphal, Mussgnug & Partner Patentanwälte mbB · Villingen-Schwenningen