Verbindungselemente für Doppelseitige Kühlvorrichtung (dsc) oder Leistungsmodul und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP4770407

Anmeldetag

19. Dezember 2025

Veröffentlichung

1. Juli 2026

Rechtsraum

EP

Abstract

A double-sided cooling (DSC) semiconductor package (213) is summarized as including a first assembly having a plurality of pillars (202) that extend outward from a first heat sink or dissipation structure (102) and at least one die (204) that is pre-coupled to the first heat sink or dissipation structure (102). A second assembly includes a plurality of flanges (210, 240) that are pre-welded or pre-coupled to a second heat sink or dissipation structure (104). The first assembly and second assembly are pre-formed before being coupled together. After the first assembly and the second assembly have been formed, the first assembly is coupled to the second assembly. After the pre-formed stacked semiconductor assembly has been formed, a molding compound (215) is applied to form the first embodiment of the double-sided cooling (DSC) semiconductor package or device.

Anmelder

Firma

STMicroelectronics International N.V.

Land

🇨🇭 Schweiz