Mehrschichtige Verbundstruktur, Herstellungsverfahren, Batterieabdeckung und Elektronische Vorrichtung
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4772343
- Anmeldetag
- 16. August 2024
- Veröffentlichung
- 26. Juni 2025
- Rechtsraum
- EP
Abstract
This application provides a multi-layer composite structure, a preparation method, a battery cover, and an electronic device. The multi-layer composite structure is formed by a plurality of stacked fiber layers. Each fiber layer is formed by impregnating a fiber sheet in a prepolymer solution followed by curing, and the fiber sheet in at least one fiber layer is made of a poly-p-phenylene benzobisoxazole fiber, i.e., a PBO fiber. In this way, the multi-layer composite structure may be endowed with higher strength and modulus. When the multi-layer composite structure is subjected to an impact, energy is absorbed and dissipated. Therefore, the reliability of the multi-layer composite structure in the impact is not compromised based on thickness and weight reduction, thereby providing excellent puncture resistance for the battery cover formed from the multi-layer composite structure.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
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