Flüssigkeitsausstosschip, Flüssigkeitsausstosskopf und Herstellungsverfahren für Flüssigkeitsausstosskopf

Details

Veröffentlichungs-Nr.

EP4772349

Anmeldetag

18. Dezember 2025

Veröffentlichung

8. Juli 2026

Rechtsraum

EP

IPC

B41J2/14, B41J2/16

Abstract

A liquid ejection chip (210) includes a first substrate (220) and a second substrate (230). A first adhesive agent layer (701a) including a first adhesive agent (701) and second adhesive agent layers (702a) including a second adhesive agent (702) are provided on a bonding surface (204a) of the second substrate (230) bonded to a liquid supply member (240). The second substrate (230) includes projecting portions (800) projecting in a first direction more than the first substrate (220) in a state where the liquid ejection chip (210) is seen from a direction perpendicular to the bonding surface (204a). The second adhesive agent layers (702a) are provided at the projecting portions (800).

Anmelder

Firma

Canon Kabushiki Kaisha

Land

🇯🇵 Japan

Fachgebiete