Optisches Modul
Anmelder: Hisense Broadband Multimedia Technologies Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4772922
- Anmeldetag
- 20. August 2024
- Veröffentlichung
- 6. März 2025
- Rechtsraum
- EP
- IPC
- G02B6/42
Abstract
An optical module is disclosed, and includes a circuit board, where the circuit board includes a first metal surface layer, a second metal surface layer, and a first metal intermediate layer. Gold fingers are provided on the first metal surface layer and provided with spring contacts, and include high-frequency signal gold fingers. A gap is provided on one side of the gold fingers. A first metal intermediate layer is located below the first metal surface layer, and a first insulating support layer is provided between the first metal intermediate layer and the first metal surface layer. A metal layer is absent from the first metal intermediate layer within a projection area of the high-frequency signal gold fingers to form a hollowed-out area. A first insulating support layer within the projection area on one side of the high-frequency signal gold fingers is hollowed out, to form a first groove.
Anmelder
- Firma
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Land
- 🇨🇳 China
Hisense Broadband Multimedia Technologies ist eine chinesische Tochtergesellschaft des Elektronikkonzerns Hisense, die optische Übertragungskomponenten entwickelt. Das Patentportfolio konzentriert sich stark auf Optik- und Fototechnik sowie Nachrichtentechnik, insbesondere optische Module und Koppler. Anmeldungen laufen von 2010 bis heute.
367 Patente in unserer Datenbank