Lichtempfindliche Zusammensetzung, Verfahren zur Herstellung eines Musters, Gehärtetes Produkt und Elektronische Komponente

Details

Veröffentlichungs-Nr.

EP4772942

Anmeldetag

7. Januar 2025

Veröffentlichung

15. Mai 2026

Rechtsraum

EP

IPC

G03F7/004

Abstract

The present invention relates to the technical field of photosensitive dielectric materials, and specifically to a photosensitive composition, a preparation method for a pattern, a cured product, and an electronic component. The photosensitive composition includes a component (a) graft polymer selected from compounds represented by structural formulas as follows:wherein Ar₁ is selected from tetravalent organic groups, Ar₂ is selected from divalent organic groups, and R' is any one selected from the group consisting of alkyl, alkoxy, cycloalkyl, and aryl; m + n = 5 to 200, n / (m + n) = 0.05 to 1, k = 2 to 10, and x = 0.5 to 10; a component (b) photoacid generator; a component (c) thermal crosslinker, which is a CH₂OR"-containing crosslinker, wherein R" is hydrogen or a monovalent organic group; and a component (d) alkaline compound. The photosensitive composition has excellent sensitivity and resolution, is capable of replicating fine patterns, and after low-temperature curing, has low warpage stress, and high chemical stability and adhesion.

Anmelder

Firmen

Jiangsu Aisen Semiconductor Material Co., Ltd.
Aisen Semiconductor Materials (Nantong) Co., Ltd.

Land

🇨🇳 China