Spulenanordnung
Anmelder: LG Electronics Inc. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4773734
- Anmeldetag
- 20. September 2024
- Veröffentlichung
- 27. März 2025
- Rechtsraum
- EP
Abstract
According to the present invention, disclosed is a coil assembly provided in an induction heating cooking device. The coil assembly comprises: a plurality of heating coil layers having formed therein a plurality of heating coils; and a wiring layer stacked on top of the plurality of heating coil layers and having formed therein heating coil wirings. The plurality of heating coil layers and the wiring layer are formed on the same substrate. According to the present invention, a container may be detected through the heating coils, without using a detection coil, by detecting a change in impedance of the heating coils.
Anmelder
- Firma
- LG Electronics Inc.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Elektronikkonzern der LG-Gruppe. Entwickelt und produziert Haushaltsgeräte, Fernseher, Klimaanlagen, Mobilgeräte sowie Komponenten für Fahrzeuge und Kommunikationstechnik.
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