Orthogonale Kühlplatte zur Verwendung bei der Aktiven Flüssigkeitsimmersionskühlung
Anmelder: Intel Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4773745
- Anmeldetag
- 17. November 2025
- Veröffentlichung
- 8. Juli 2026
- Rechtsraum
- EP
- IPC
- H05K7/20
Abstract
A cold plate comprises a plurality of fins. The individual fins have an opening, and the openings collectively define a first channel through the plurality of fins. During operation of an integrated circuit component attached to the cold plate, coolant is pumped through the cold plate. The coolant flows in a first direction through the first channel and then in a second through second channels located between the fins. The first direction is substantially orthogonal to the second direction. The first channel can comprise a tube that has openings that direct coolant to flow into the second channels. The first channel is located close to the base plate of the cold plate so that there is a high degree of heat transfer between an integrated circuit component attached to the cold plate and coolant flowing through the cold plate.
Anmelder
- Firma
- Intel Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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