Legierungspulver Enthaltende Zusammensetzung und Halbleitervorrichtung
Anmelder: Daicel Corporation, The University of Osaka 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4775327
- Anmeldetag
- 3. September 2024
- Veröffentlichung
- 13. März 2025
- Rechtsraum
- EP
Abstract
Provided is an alloy powder-containing composition that operates at high temperatures and exhibits excellent mounting properties and bonding reliability while complying with environmental regulations. The alloy powder-containing composition of the present disclosure is characterized by containing an alloy powder having an AgSi eutectic structure, a silver (Ag) powder, and an organic substance. In addition, in the present disclosure, the content of silver (Ag) relative to the total amount of the alloy powder is preferably from 15 to 97.6 mass%, the content of the silver (Ag) powder is preferably from 5 to 2000 parts by mass per 100 parts by mass of the alloy powder, and the content of silver relative to the total amount of the alloy powder and the silver (Ag) powder is preferably from 20 to 99.9 mass%.
Anmelder
- Firmen
- Daicel Corporation
The University of Osaka - Land
- 🇯🇵 Japan
Daicel Corporation ist ein japanisches Chemieunternehmen, das Celluloseacetat, Airbag-Gasgeneratoren und Spezialchemikalien herstellt.
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