Legierungspulver, Legierungspulver und Halbleiterbauelement

Details

Veröffentlichungs-Nr.

EP4775328

Anmeldetag

3. September 2024

Veröffentlichung

13. März 2025

Rechtsraum

EP

Abstract

Provided is an alloy powder that can form a bonding layer that operates at high temperatures and exhibits excellent bonding reliability while complying with environmental regulations. An alloy powder of the present disclosure is characterized by having an AgSi eutectic structure, in which the proportion of the AgSi eutectic structure is 10% or more in at least 8 or more of 10 particles when any 10 adjacent particles of the alloy powder are subjected to a method including selecting one particle from an image of a particle cross section, the image being captured by SEM at a magnification of from 2000 to 50000 times, measuring a total outer peripheral length of the particle and a length of an outer peripheral portion where the eutectic structure is present, a region where no eutectic structure is present in a region from the outer periphery to 0.2 µm in a direction toward the center of the particle being excluded from the outer peripheral portion, and calculating a proportion of the length of the outer peripheral portion thereof to the total outer peripheral length as the proportion of the AgSi structure on the particle surface.

Anmelder

Firmen

Daicel Corporation
The University of Osaka

Land

🇯🇵 Japan