Verfahren zur Trennung von Klebstoff und Basismaterial
Anmelder: Nitto Denko Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4775370
- Anmeldetag
- 21. August 2024
- Veröffentlichung
- 13. März 2025
- Rechtsraum
- EP
- IPC
- B29B17/00
Abstract
Provided is a method for easily sorting, from a mixture including a pressure-sensitive adhesive and a substrate, the pressure-sensitive adhesive and the substrate.The method according to the embodiment of the present invention for sorting a pressure-sensitive adhesive and a substrate is a method for sorting, from a mixture (A) including a pressure-sensitive adhesive, a substrate, and a first organic solvent, the pressure-sensitive adhesive and the substrate, and at least one operation selected from the group consisting of (i), (ii), and (iii) below is performed: (i) an operation of stirring the mixture (A) in a saturated aqueous solution of the first organic solvent; (ii) an operation of stirring the mixture (A) in a water-containing liquid mixture containing at least one selected from the group consisting of a second organic solvent and a third organic solvent in an amount exceeding a saturation solubility thereof; and (iii) an operation of, after immersion of the mixture (A) in the third organic solvent, recovering a mixture (B) obtained by the immersion and stirring the mixture (B) in water.
Anmelder
- Firma
- Nitto Denko Corporation
- Land
- 🇯🇵 Japan
Japanisches Materialwissenschafts- und Chemieunternehmen mit Sitz in Osaka. Nitto Denko entwickelt Klebebänder, Folien, optische Materialien für Displays sowie Membranen und Materialien für Elektronik, Automobil und Medizintechnik.
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Hoffmann Eitle
Hoffmann Eitle · München