Härtbare Zusammensetzung

Details

Veröffentlichungs-Nr.

EP4775627

Anmeldetag

28. September 2022

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

IPC

C08K3/013

Abstract

The present specification discloses a resin composition and a use thereof. In the present application, it is possible to provide a resin composition or a cured product thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The present application can also provide a product comprising the resin composition or the cured product thereof.

Anmelder

Firma

LG Chem, Ltd.

Land

🇰🇷 Südkorea