Wärmeleitfähige Silikonzusammensetzung

Details

Veröffentlichungs-Nr.

EP4775635

Anmeldetag

5. September 2024

Veröffentlichung

13. März 2025

Rechtsraum

EP

Abstract

Provided is a thermally conductive silicone composition having low thermal resistance and excellent reliability. The thermally conductive silicone composition contains the following components (A), (B), (C), (D), (E), and (F): (A) an organopolysiloxane having at least two alkenyl groups at ends of the molecular chain and having a kinematic viscosity at 25°C of 100 to 500,000 mm<2>/s; (B) a hydrolyzable methylpolysiloxane having three functional groups at one end and represented by the following general formula (1), <img class="EMIRef" id="069c41dd-cdfd-4b98-9e17-9d6d2ce7414f-ia01" /> wherein, in the formula (1), R<1> is an alkyl group having 1 to 6 carbon atoms, and a is a number of from 5 to 100); (C) a bismuth tin-based alloy powder having a melting point of 220°C or lower; (D) a heat conductive filler different from the component (C) and having a melting point of 280°C or higher and an average particle diameter of 3 µm or more; (E) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded directly to silicon atoms (Si-H groups) per molecule; and (F) a catalyst selected from platinum and platinum compounds.

Anmelder

Firma

SHIN-ETSU CHEMICAL CO., LTD.

Land

🇯🇵 Japan