Kühlplatte

Details

Veröffentlichungs-Nr.

EP4776772

Anmeldetag

9. Dezember 2025

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

Provided is a cooling plate (A) for cooling an electronic component (8) to be cooled by a cooling liquid (F) flowing through a cooling flow path (P). The cooling plate includes: a plate member (10, 11) having a plate surface (10b, 15a) with which the electronic component comes into contact. The cooling flow path is formed in the plate member. The cooling flow path includes a first cooling flow path portion (21), a second cooling flow path portion (S) located downward further than the first cooling flow path portion in a gravity direction and downstream in a flow direction of the cooling liquid, and a supply flow path portion (23) inclined downward to connect the first cooling flow path portion and the second cooling flow path portion. A plurality of fins (16) formed on the plate member are housed in the second cooling flow path portion. The electronic component comes into contact with a portion of the plate surface that is close to the second cooling flow path portion.

Anmelder

Firma

AISIN CORPORATION

Land

🇯🇵 Japan

Fachgebiete