Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4776773

Anmeldetag

22. Dezember 2025

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

Provided is an electronic device capable of effectively cooling heat radiated from a heat-generating electronic component provided in a case by a heat sink, and inhibiting any impact on electronic circuits and the like by moisture intruding into the case. A heat sink provided inside the case has a plurality of protrusions extending perpendicularly toward a facing wall part of the case. Air entering the case from a first air intake hole formed in the facing wall part is dispersed and periodically diffused by the protrusions, and exhausted outside via a gas exhaust hole by a power fan. Moisture intruding into the case is drained downward through a water draining path along upper surfaces of a first bank part and a second bank part.

Anmelder

Firma

Alps Alpine Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete