Elektronische Vorrichtung und Verfahren zur Herstellung einer Elektronischen Vorrichtung

Details

Veröffentlichungs-Nr.

EP4776795

Anmeldetag

3. September 2024

Veröffentlichung

13. März 2025

Rechtsraum

EP

IPC

H10F39/12, H01L23/02

Abstract

To improve the joining strength between chips without increasing the planar size of the chips. An electronic device includes a first chip including a first joining region and a first recess formed in a part of the first joining region, and a second chip joined to the first chip through a second joining region facing the first joining region. A first recess may be discretely disposed at a periphery of the first chip. The first recess may be a groove continuously formed at the periphery of the first chip. The second chip may include a second recess formed in a part of the second joining region. The second chip may include a device region located inside the second joining region.

Anmelder

Firma

Sony Semiconductor Solutions Corporation

Land

🇯🇵 Japan

Fachgebiete