Verfahren zur Herstellung von Halbleiterbauelementen und Zugehöriges Halbleiterbauelement

Details

Veröffentlichungs-Nr.

EP4776837

Anmeldetag

30. Dezember 2025

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

Abstract

A semiconductor die (14) is arranged at a die pad (10) of a leadframe (21) comprising an array of electrically conductive leads (12, 22) around the die pad (10). The array including a first (12) and a second (22) set of electrically conductive leads (22).At least one conductive lead in the first set of electrically conductive leads (22) comprises a base lead portion (22A) co-planar with the die-pad (10) and a raised lead portion (22B), wherein the die pad (10) is arranged at a downset location with respect to said raised lead portion (22B).The semiconductor die (14) is electrically coupled to leads (12) in the second set of electrically conductive leads (12) via electrically conductive wires (16) extending therebetween.The semiconductor die (14) is electrically coupled to the at least one conductive lead (22) in the first set of electrically conductive leads (22) by applying onto the semiconductor die (14) and the electrically conductive wires (16) an electrically conductive clip (28) comprising an electrically conductive protrusion (280) electrically coupled to the semiconductor die (14) as well as at least one distal portion (282) electrically coupled to the raised lead portion (22B) of the at least one conductive lead (22) in the first set of electrically conductive leads (22).

Anmelder

Firma

STMicroelectronics International N.V.

Land

🇨🇭 Schweiz