Laminat, Verpackungsbeutel und Hitzesterilisierungsbeutel
Anmelder: Dai Nippon Printing Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4778721
- Anmeldetag
- 26. September 2024
- Veröffentlichung
- 3. April 2025
- Rechtsraum
- EP
Abstract
A laminate that has heat resistance to withstand heat sterilization treatment and high openability after the heat sterilization treatment when used for a packaging bag, such as a retort pouch, is a laminate that includes a second substrate, a second adhesive layer, and a sealant layer in this order in a thickness direction, wherein the second substrate is a polypropylene stretched substrate, the sealant layer is an unstretched polypropylene film, the second substrate has a thermal shrinkage ratio of less than 2% after heating at 120°C for 15 minutes, the sealant layer has a thermal shrinkage ratio of 0% or more and 0.5% or less after heating at 120°C for 15 minutes, and the second adhesive layer has a modulus of elasticity of 15.0 MPa or more and a thickness of 0.5 µm or more and 10.0 µm or less.
Anmelder
- Firma
- Dai Nippon Printing Co., Ltd.
- Land
- 🇯🇵 Japan
Japanisches Unternehmen der Druckindustrie mit Sitz in Tokio, das sich über klassische Druckerzeugnisse hinaus in Elektronikmaterialien, Displaykomponenten und Verpackungslösungen diversifiziert hat.
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