Harzzusammensetzung, Gehärteter Artikel, Prepreg, Metallfolienkaschierte Laminatplatte, Harzverbundfolie, Leiterplatte und Halbleiterbauelement

Details

Veröffentlichungs-Nr.

EP4778949

Anmeldetag

12. September 2024

Veröffentlichung

20. März 2025

Rechtsraum

EP

Abstract

Disclosed is a resin composition including a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton, a thermoplastic elastomer (B), and at least one thermosetting compound (C) selected from the group consisting of a compound having a polymerizable carbon-carbon unsaturated double bond at a terminal other than the resin (A), a maleimide compound, and a cyanate ester compound, in which the thermoplastic elastomer (B) includes a hydrogenated butadiene monomer unit and/or a hydrogenated isoprene monomer unit. In Formula (T1), each Ma independently represents a hydrocarbon group having from 1 to 12 carbon atoms, each carbon atom being optionally substituted with a halogen atom, and x represents an integer of from 0 to 4. * represents a bonding position for another moiety. Disclosed are a cured product using the resin composition, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. <img class="EMIRef" id="3badb5da-7d8a-4d52-8689-02ad7b688a90-ia01" />

Anmelder

Firma

MITSUBISHI GAS CHEMICAL COMPANY, INC.

Land

🇯🇵 Japan