Harzzusammensetzung, Gehärtetes Produkt, Prepreg, Metallfolienkaschiertes Laminat, Harzverbundfolie, Leiterplatte und Halbleiterbauelement
Anmelder: MITSUBISHI GAS CHEMICAL COMPANY, INC. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4778950
- Anmeldetag
- 12. September 2024
- Veröffentlichung
- 20. März 2025
- Rechtsraum
- EP
Abstract
Disclosed is a resin composition including: a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton; a compound (B) having a polymerizable carbon-carbon unsaturated double bond and having a number average molecular weight of 400 or less; and a thermosetting compound (C) having a number average molecular weight of more than 400 (however, the compound (B) and the compound (C) are not compounds corresponding to the resin (A)). In Formula (T1), each Ma independently represents a hydrocarbon group having 1 to 12 carbon atoms, each carbon atom being substituted with a halogen atom, and x represents an integer of from 0 to 4. * represents a bonding position for another moiety. Disclosed are a cured product using the resin composition, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. <img class="EMIRef" id="80371477-2670-4f04-8e7d-cf9fc015bffe-ia01" />
Anmelder
- Firma
- MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Land
- 🇯🇵 Japan
Japanisches Chemieunternehmen der Mitsubishi-Gruppe mit Fokus auf technische Kunststoffe, Methanol und Spezialchemikalien. Der Konzern beliefert unter anderem die Elektronik- und Verpackungsindustrie.
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