Wärmeableitungsanordnung für Elektronische Vorrichtungen

Details

Veröffentlichungs-Nr.

EP4779687

Anmeldetag

16. Januar 2025

Veröffentlichung

22. Juli 2026

Rechtsraum

EP

IPC

H01L23/367, H01L23/467

Abstract

The present disclosure relates to a heat dissipation arrangement (101) for electronic devices (103), comprising a base plate (104) and a plurality of cooling fins (105, 106). The cooling fins (105, 106) are formed on, and protrude from, the base plate (104) in a first region (107) and a second region (108), where most cooling fins (105) in the first region (107) have a corresponding arcuate shape. The heat dissipation arrangement (101) comprises a third region (112) that at least partly separates the first region (107) from the second region (108) and is adapted to receive air (111) injected by means of an electric fan (102). Most of the cooling fins (106) in the second region (108) are inclined or curved with respect to the direction of incoming ambient air (110) from one direction and air (111) injected by means of an electric fan (102) from another direction, such that ambient air (110) and air (111) injected by means of an electric fan (102) both are guided towards the cooling fins (105) of the first region (107).

Anmelder

Firma

Magna Electronics Sweden AB

Land

🇸🇪 Schweden

Fachgebiete