Elektronisches Bauelement und Substrat mit Eingebautem Elektronischen Bauelement

Details

Veröffentlichungs-Nr.

EP4783200

Anmeldetag

25. Juni 2024

Veröffentlichung

27. März 2025

Rechtsraum

EP

Abstract

To provide an electronic component suitable for incorporation into a substrate. An electronic component 10 includes a magnetic element body 20 and a metal frame 30 embedded in the magnetic element body 20. The metal frame 30 includes substantially parallel sections 31 and 32, a section 33 connecting one end of the section 31 and one end of the section 32, a section 34 connected to the other end of the section 31 and exposed at least partially on the main surface 21 of the magnetic element body 20, and a section 35 connected to the other end of the section 32 and exposed at least partially on the main surface 22 of the magnetic element body 20.

Anmelder

Firma

TDK Corporation

Land

🇯🇵 Japan