Zusammensetzung und Kit sowie Verfahren zur Entfernung von Resist und Verfahren zur Herstellung eines Elektronischen Substrats damit
Anmelder: MITSUBISHI GAS CHEMICAL COMPANY, INC. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4783231
- Anmeldetag
- 19. September 2024
- Veröffentlichung
- 27. März 2025
- Rechtsraum
- EP
Abstract
Provided are a composition and the like that can suppress oxidation of copper wiring after resist removal. A composition that includes a basic compound; and a copper surface protective agent including at least one selected from the group consisting of an ammonium salt represented by the following formula (1), a heteroaryl salt having a substituted or unsubstituted alkyl group having 5 to 30 carbon atoms, and a substituted or unsubstituted thiol having 5 to 30 carbon atoms; and that has a pH of 13 or higher. In the formula (1), R<sup>1</sup> is a substituted or unsubstituted alkyl group having 5 to 30 carbon atoms, a substituted or unsubstituted alkyl(poly)heteroalkylene group having 5 to 30 carbon atoms, or a substituted or unsubstituted aryl(poly)heteroalkylene group having 7 to 30 carbon atoms; R<sup>2</sup> is each independently a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 30 carbon atoms; and X is a halide ion, a hydroxide ion, an organic sulfonate ion, a tetrafluoroborate anion, or a hexafluorophosphate anion.
Anmelder
- Firma
- MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Land
- 🇯🇵 Japan
Japanisches Chemieunternehmen der Mitsubishi-Gruppe mit Fokus auf technische Kunststoffe, Methanol und Spezialchemikalien. Der Konzern beliefert unter anderem die Elektronik- und Verpackungsindustrie.
2.580 Patente in unserer Datenbank