Laminatherstellungsvorrichtung und Laminatherstellungsverfahren

Details

Veröffentlichungs-Nr.

EP4783754

Anmeldetag

28. August 2024

Veröffentlichung

27. März 2025

Rechtsraum

EP

IPC

H05K1/05

Abstract

Proposed is a laminate production tool for a laminate including a circuit pattern having a thickness of 0.8 mm or more, enabling prevention of a trouble from occurring in an insulating layer. A laminate production tool (10) is used for heating and pressurizing, in a chamber (50), a laminate before press bonding (1A) including a metal base substrate (2), a resin composition (3A) that is semi-cured, and a circuit body (C) that are laminated on top of each other, the circuit body (C) including a circuit pattern (4) or a mount body, the circuit pattern (4) having a thickness of 0.8 mm or more, the mount body including the circuit pattern (4) on which an electronic component is mounted. The laminate production tool (10) includes: a base jig (11) for attachment of the laminate before press bonding (1A); a film (13) that covers at least the resin composition (3A) and the circuit body (C); and a cover jig (12) that sandwiches the film (13) in cooperation with the base jig (11), in which the base jig (11) includes an outlet (11e) for exhaustion inside the film (13) that covers the resin composition (3A) and the circuit body (C), and the cover jig (12) includes an opening (12a) for exposure of an entire area of a covering part (13a) that covers the resin composition (3A) and the circuit body (C) in the film (13).

Anmelder

Firma

NHK Spring Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete