System und Vorrichtung zur Kühlung von Leistungselektronik

Details

Veröffentlichungs-Nr.

EP4783764

Anmeldetag

22. Januar 2026

Veröffentlichung

29. Juli 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

A cooling system and apparatus for power electronics includes a first heat sink and a second heat sink with coolant flow paths that receive coolant for cooling different sides of the power electronics. A first connector assembly at the inlet ends of the first and second heat sinks connects the coolant flow paths to a cooling loop, receives the coolant from the cooling loop, and splits the coolant between the coolant flow paths of the first and second heat sinks. A second connector assembly at the outlet ends of the first and second heat sinks collects the coolant flow from the coolant flow paths of the first and second heat sinks and outlets the combined coolant flows to the cooling loop.

Anmelder

Firma

Cummins, Inc.

Land

🇺🇸 USA

Fachgebiete