Halbleiteranordnungen und Verfahren zur Kühlung einer Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung

Details

Veröffentlichungs-Nr.

EP4787436

Anmeldetag

25. April 2025

Veröffentlichung

5. August 2026

Rechtsraum

EP

Abstract

The invention concerns a semiconductor assembly (1) and methods of manufacturing and cooling same. the semiconductor assembly (1) comprises: - at least one first chip (10) and at least one second chip (12), wherein the first chip (10) is provided with at least one cooling structure (42) through which cooling fluid can flow; - a manifold having at least one inlet port (36) for receiving a cooling fluid, and at least one outlet port (38) for releasing the cooling fluid; - at least one cover member (14) having a first face (50) that is arranged opposite to at least a section of a first surface (52) of the at least one second chip (12), wherein a space (48) in which cooling fluid can flow is defined between the first face (50) and first surface (52) and the space (48) is fluidically connected to the manifold (34); - at least a first sealing member (18) at least a section of which is arranged between the manifold (34) and the first chip (10), wherein the first sealing member (18) comprises at least one fluid opening (22) that fluidically connects the cooling structure (42) of the first chip (10) and the manifold (34), wherein the cover member (14) is more rigid and/or harder than the first sealing member (18), in particular at least 50-times more rigid and/or at least 2-times harder.

Anmelder

Firma

Corintis SA

Land

🇨🇭 Schweiz