Kühlsystem für Lötverbindung

Details

Veröffentlichungs-Nr.

EP4788066

Anmeldetag

3. Februar 2025

Veröffentlichung

5. August 2026

Rechtsraum

EP

IPC

H05K1/02, // H05K3/34

Abstract

The invention relates to a solder joint cooling system, comprising 1) a printed circuit board (4) comprising a through hole through which a lead (3) of an electrical component (1) is inserted, wherein the printed circuit board (4) comprises at least one conductive layer and at least one insulating layer, with the printed circuit board (4) comprising a component side (5) and a solder side (6) opposite the component side (5), wherein a first conductive layer of the at least one conductive layer is arranged on the solder side (6) of the printed circuit board (4), 2) the electrical component (1), wherein the electrical component (1) is mounted on the component side (5) of the printed circuit board (4) and the lead (3) of the electrical component (1) is soldered to a pad of the printed circuit board (4), which pad is positioned on the solder side (6) of the printed circuit board (4) and which pad is part of the first conductive layer, with the lead (3) being connected with a solder joint (2) to the pad, and with the pad surrounding the through hole on the solder side (6), 3) a thermally conductive enclosure portion (8) and a cooling sink (12), wherein the enclosure portion (8) is connected to the printed circuit board (4) and to the cooling sink (12), wherein the enclosure portion (8) is positioned such with respect to the printed circuit board (4) and the cooling sink (12) that the enclosure portion (8), the solder side (6) of the printed circuit board (4) and the cooling sink (12) together surround an enclosed space (11), with the solder joint (2) being inside the enclosed space (11), and wherein the enclosed space (11) is filled with a thermally conductive and electrically insulating gap filler (7), with the gap filler (7) being in contact with the cooling sink (12), with the enclosure portion (8), with the printed circuit board (4) and with the solder joint (2). The invention also relates to a method for assembling the solder joint cooling system.

Anmelder

Firma

Delta Electronics (Thailand) Public Co., Ltd.

Land

🇹🇭 Thailand

Fachgebiete