Verbindungsstifte in einem Substrat
Anmelder: Shenzhen STS Microelectronics Co., Ltd., STMicroelectronics International N.V. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4788116
- Anmeldetag
- 16. Januar 2026
- Veröffentlichung
- 5. August 2026
- Rechtsraum
- EP
Abstract
A packaged device having conductive pillars coupled with a substrate and connecting pins in openings of the conductive pillars. The device further including a molding compound on the substrate and conductive pillars. Methods of coupling connecting pins in the substrate without the use of pinholders. The methods including forming openings in the molding compound and conductive pillars and inserting the pins in the openings of the conductive pillars.
Anmelder
- Firmen
- Shenzhen STS Microelectronics Co., Ltd.
STMicroelectronics International N.V. - Land
- 🇨🇳 China
Schweizer Gesellschaft des Halbleiterkonzerns STMicroelectronics, die Chips und Sensoren für Automobiltechnik, Industrie und Unterhaltungselektronik entwickelt.
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