Korrosionsbeständige Leistungselektronikmodule
Anmelder: Rockwell Automation Technologies, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4788117
- Anmeldetag
- 20. Januar 2026
- Veröffentlichung
- 5. August 2026
- Rechtsraum
- EP
Abstract
Disclosed is a corrosion resistant power electronic module having a metal-ceramic substrate including a ceramic layer and a metallic layer, where the metallic layer includes metal bonded to the ceramic layer such that trenches are formed between portions of the metal through which the surface of the ceramic layer is exposed. In a first embodiment, portions of the exposed surface of the ceramic layer are melted in the trenches to modify the surface layer, lowering the roughness, which inhibits corrosion growth in corrosive gas environments. In a second embodiment, a barrier material is disposed within the trenches and bonded to the exposed surface of the ceramic layer such that once bonded, the barrier material does not physically contact the metal of the metallic layer. In a third embodiment, the ceramic layer comprises a high density, ultra-low roughness ceramic insulator.
Anmelder
- Firma
- Rockwell Automation Technologies, Inc.
- Land
- 🇺🇸 USA
US-amerikanisches Unternehmen, das Industrieautomatisierung entwickelt, darunter Steuerungssysteme, Software und Antriebstechnik für Fertigungsbetriebe.
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