Harzzusammensetzung für T-Chip-Extrusionsformung

Details

Veröffentlichungs-Nr.

EP4790098

Anmeldetag

19. September 2024

Veröffentlichung

10. April 2025

Rechtsraum

EP

Abstract

A resin composition for T-die extrusion molding contains: 100 parts by weight of a poly(3-hydroxyalkanoate) resin (A); 0.3 to 3 parts by weight of a layered clay mineral (B) having a mean particle diameter D50 of 1 to 5 µm and a specific surface area, as determined by BET method, of 10 to 40 m<2>/g; and 0.3 to 3 parts by weight of a fatty acid amide compound (C). The resin composition has a melt viscosity, as measured at a temperature of 175 °C and a shear rate of 122 s<-1>, of 300 to 1000 Pa·s.

Anmelder

Firma

Kaneka Corporation

Land

🇯🇵 Japan