Harzzusammensetzung, Gehärtetes Isolierharzprodukt, Laminat und Leiterplatte
Anmelder: Denka Company Limited 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4790107
- Anmeldetag
- 3. Oktober 2024
- Veröffentlichung
- 10. April 2025
- Rechtsraum
- EP
Abstract
Provided is a resin composition including a thermosetting resin, an inorganic filler, and an inorganic ion scavenger, wherein: the inorganic filler includes a first particle group having a peak, in a particle size distribution curve, in the range of 0.1 µm or more and 15 µm or less, and a second particle group having a peak, in the particle size distribution curve, in the range of more than 15 µm and 300 µm or less; the content of the first particle group is 1 vol.% or more and 60 vol.% or less with respect to the total content of the first particle group and the second particle group; and the content of the inorganic ion scavenger is 0.1-50 mass% with respect to the total mass of the thermosetting resin.
Anmelder
- Firma
- Denka Company Limited
- Land
- 🇯🇵 Japan
Japanischer Chemiekonzern mit Sitz in Tokio, tätig in den Bereichen elektronische Materialien, Zement und Elastomere.
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Vertreten von
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Hoffmann Eitle
Hoffmann Eitle · München