Verbessertes Erdungssystem und Erdungsverfahren für Abgeschirmte Metallschichtkabel

EP4790837 12. August 2026

Anmelder: TE Connectivity Solutions GmbH 🇨🇭

Details

Veröffentlichungs-Nr.
EP4790837
Anmeldetag
5. Februar 2025
Veröffentlichung
12. August 2026
Rechtsraum
EP
IPC
H01R9/05, H02G15/188, H01R4/20
Offizieller Volltext

Abstract

The present invention provides grounding systems and methods for grounding a screened cable having a metal layer screen around an insulation sleeve of the cable conductive core. The grounding system comprises a stabilizing structure adapted to be directly mounted on and around an outer surface of the insulation sleeve to separate said insulation sleeve from an inner surface of the metal layer screen. The stabilizer structure allows to separate the metal screen from the cable insulation sleeve, and therefore, prevent a relative displacement among the grounding system parts that may be caused by repeated heating cycles. Thus, an increase of the contact resistance can be avoided as well as a deterioration of the contact plates, an overheating of the metal screen and consequent damage of the cable insulation. The present invention also provides a screened cable comprising the grounding system.

Anmelder

Firma
TE Connectivity Solutions GmbH
Land
🇨🇭 Schweiz
🇨🇭 TE Connectivity Solutions

Schweizer Konzerngesellschaft von TE Connectivity mit Sitz in Schaffhausen. Sie entwickelt Verbindungs- und Sensortechnik für Automobil-, Industrie- und Kommunikationsanwendungen.

1.167 Patente in unserer Datenbank

Noch Fragen?

Wir helfen Ihnen gerne weiter. Schreiben Sie uns einfach.

Kontakt aufnehmen